Job Description:

The Principal Mechanical Engineer will lead the design, development, and optimization of mechanical systems specifically for semiconductor manufacturing equipment. This role requires a multidisciplinary approach, blending mechanical engineering with material science, thermal management, and process engineering to meet the stringent demands of semiconductor fabrication. The candidate will also manage teams, collaborate with suppliers, and make data-driven decisions to support product innovation.

Key Responsibilities:

Lead Design and Development: Spearhead the development of complex mechanical systems for semiconductor tools, including structures, thermal management, and precision motion systems.
Multidisciplinary Collaboration: Work closely with teams across mechanical, materials science, and process engineering to ensure seamless integration of mechanical systems into semiconductor equipment.
Data-Driven Decision Making: Conduct rigorous statistical analysis, evaluate test data, and make data-backed decisions to improve performance and reliability.
Lifecycle Management: Oversee the product lifecycle from concept to manufacturing, ensuring that designs meet performance, cost, and scalability targets.
Supplier Collaboration: Partner with suppliers to develop cost-effective and innovative hardware solutions.
Team Leadership: Mentor and manage a team of engineers, providing technical leadership while ensuring project goals are met on time.
Communication: Prepare and deliver both technical and executive-level presentations, conveying complex ideas and driving decisions across all levels of the organization.

Requirements:

Ph.D. in Mechanical Engineering or a related field, preferably from a recognized U.S. institution.
10+ years of experience in mechanical engineering, specifically within the semiconductor industry, with a proven track record in designing systems for high-precision manufacturing.
Proficiency in CAD and Analysis Tools: Expertise in CAD software (AutoCAD, SolidWorks, CATIA) and simulation tools (ANSYS, COMSOL) with experience in thermal, stress, and fluid dynamics simulations.
Leadership and Project Management: Demonstrated ability to lead cross-functional teams and manage large-scale engineering projects.
Supplier and Cost Collaboration: Experience working closely with suppliers to drive innovation and meet hardware development cost targets.

Preferred:

Experience with semiconductor tools such as deposition, etching, or metrology.
Published research in mechanical engineering or related fields.
Strong communication skills, capable of translating technical challenges into actionable insights for both engineering teams and executives.
Target Companies: Applied Materials, LAM Research, TEL
Job Type: Full-time

Pay: $160,270.00 – $200,000.00 per year
an exceptionally generous sign-on bonus, designed to attract top talen
Work Location: In person

Resume Submission: Annie@personalink.me